INFRARED AND MILLIMETER WAVES: INSTRUMENTATION
1 Research Impact of System-Level Packaging for Millimeter-Wave Transceivers 1 11 Significance of Device Packaging at Millimeter-Wave Range and Systems Approach 5 12 Research Contextualization: A Modern Communication System 5 121 Transmitter 6 122 Transmitting and Receiving Antennas 10 123 The Receiver 10 124 Example of State-of-the-Art Transceiver 14 13 Other Considerations: Substrates, Active Devices and Passives 16 14 Practical Research Focus: Applications of Millimeter-Wave Systems 17 15 Identifying Research Gaps: Packaging Techniques and Technologies 19 151 Traditional Approach—A One-Chip Solution 19 152 A Two-Chip Solution 20 153 Packaging Multiple Dice 20 154 The Ultimate Goal: System Optimization Through Improved Packaging 22 155 The Packaging Decision 23 16 Research Questions: Packaging for Millimeter-Wave Applications 24 17 Contribution to the Body of Knowledge 25 18 Content Overview 26 References 27 2 Millimeter-Wave Research Challenges 31 21 Wavelength Significance 31 22 The Millimeter-Wave Part of the Spectrum 32 23 Propagation of Millimeter Waves 35 24 Antennas for Millimeter-Waves 37 241 General Antenna Theory 38 242 Millimeter-Wave Antennas 40 25 Millimeter-Wave Considerations 43 251 Losses 43 252 Uncertainty 44 253 Feasibility of Component Values 45 254 Interconnects and Component Sizing 46 255 Coupling and Shielding 46 256 Layout Dependency 47 257 Bonding 49 258 Package Leads 50 259 Concluding Remarks 51 References 52 3 Behavior of Active and Passive Devices at Millimeter-Wave Frequencies 55 31 Solid-State Active Devices 56 311 Metal-Oxide Transistors 56 312 MOSFET Operation at Millimeter Wave Frequencies 61 313 Bipolar Transistors 63 314 HBT Operation at Millimeter Wave Frequencies 66 315 Noise Figure in HBTs and MOSFETs 68 32 Transmission Lines 68 321 Q-Factors of Passive Devices 69 322 Introduction to Transmission Lines 69 323 Types of Transmission Lines 70 324 General Transmission Line 71 325 The Quarter-Wave Transformer 73 326 Substrate Integrated Waveguides 75 327 Slow Co-planar Waveguides 76 33 Resistors 80 34 Capacitors 82 341 Parallel-Plate Capacitors 82 342 Transmission-Line Capacitors 83 343 Other Capacitors 84 35 Inductors 86 351 Wound Inductors 86 352 Integrated Inductors 88 353 Embedded Inductors 94 354 Bond Wires 96 355 Transmission-Line Inductors 96 356 RF Chokes 98 36 Transformers and Baluns 98 37 Concluding Remarks 101 References 101 4 Integrated Substrates: Millimeter-Wave Transistor Technologies 105 41 Means for Comparison of Technologies 107 42 CMOS Technology 108 421 Important Characteristics 108 422 State-of-the-Art CMOS Technologies 109 43 High-Electron Mobility Transistor Technology 109 431 Important Characteristics 109 432 State-of-the-Art High-Electron Mobility Technologies 111 44 Heterojunction Bipolar Transistor Technology 111 441 Important Characteristics 112 442 State-of-the-Art Heterojunction Bipolar Technologies 112 45 Other Technologies 113 46 Comparative Analysis 114 47 Advanced Fabrication Techniques 116 48 Concluding Remarks 125 References 125 5 Discrete Substrates: Package Foundation 129 51 Classification of Substrates 131 52 Important Substrate Properties 132 521 Dielectric Constant 133 522 Loss Tangent 134 523 Electrical Conductivity 135 524 Skin Depth 135 525 Thermal Properties 135 526 Reliability 137 527 Dielectric Breakdown 138 528 Substrate Thickness 138 529 Other Properties 138 53 Laminate Substrates 139 54 Ceramics 140 541 Thin-Film Ceramics 141 542 Thick-Film Ceramics 141 543 Low-Temperature Co-fired Ceramics and High-Temperature Co-fired Ceramics 142 544 Composite Ceramics 144 55 Organic Substrates 145 56 Silicon as a Discrete Substrate 147 57 Other Materials 148 58 Substrate Performance Comparison and Substrate Choice 150 59 Concluding Remarks 152 References 154 6 Traditional Approach: System-on-Chip 157 61 Main Characteristics and Challenges of the System-on-Chip Approach to Packaging 157 62 Traditional Packages and Bonding 160 63 Flip Chip Packaging 162 631 Flip Chip Advantages for Millimeter-Wave Regime 164 632 Flip Chip Challenges 165 633 Flip Chip Packaging Options 166 64 Electromagnetic Coupling as the First-Level Interconnect 167 65 Circuit Reusability 168 66 On-Chip Sensors 169 67 Transceiver/Antenna Co-design and Antennas on Chip 170 671 Main Considerations of Antennas on Chip 171 672 State-of-the-Art On-Chip Antennas 174 68 Simulation and Design of Packaged SoCs and System-Package Co-design 176 69 State-of-the-Art Millimeter-Wave System-on-Chip Examples 180 691 A 60 GHz System-on-Chip Transmitter with Built-in Memory and an On-Chip Antenna 180 692 A 120–145 GHz Heterodyne Receiver for Atmospheric Passive Sensing 181 693 A 122 GHz Radar System-on-Chip 183 694 60 GHz Low-Power Receiver for a Monolithic Wireless Sensor Without a Battery 184 610 Economics of System-on-Chip 186 611 Testing of System-on-Chip 188 612 Concluding Remarks 189 References 189 7 Multi-chip Modules and Multi-chip Packaging 193 71 Multi-chip Packaging Options 195 72 Main Characteristics and Challenges of the Multi-chip Packaging Approach 199 73 3D Packaging 200 731 Processing and Stacking of 3D Wafers 201 732 Wafer Thinning 202 733 3D Wafer Bonding 203 734 Heat and Cooling 205 735 Reliability 208 736 Coupling and Shielding 210 74 Interconnects 210 741 Chip-to-Substrate Interconnects 210 742 Horizontal Transitions 212 743 Vertical Transitions 213 75 Simulation of Multi-chip Modules and 3D Packages 218 76 State-of-the-Art Multi-chip Module Examples 219 761 3D IC Test Vehicle on the 300 mm Multi-project Wafer 220 762 Stochastic Flash Analog-to-Digital Converter for Integration with an Ultrasound Transducer Array 222 77 Testing of Multi-chip Modules 222 78 Economics of Multi-chip Modules 224 79 Concluding Remarks 225 References 226 8 State-of-the-Art Approach: System-on-Package 229 81 Main Characteristics, Advantages and Challenges of the System-on-Package Approach 231 82 Popular System-on-Package Technologies 233 821 Embedded Wafer Level Ball Grid Array Packaging 234 822 Low-Temperature Co-fired Ceramics System-on-Package 235 823 Liquid-Crystal Polymer System-on-Package 235 824 System-on-Package for Micro-Electro-Mechanical Systems 236 825 Glass Substrate System-on-Package 237 826 Silicon Substrate System-on-Package 238 827 Other System-on-Package Technologies 240 83 System-on-Package Design Challenges 241 831 Interconnects and Transitions 242 832 Material Mix in System-on-Package 246 833 System Reliability 248 84 High-Quality Passives 248 841 Inductors 248 842 Capacitors 250 843 Resistors 250 85 In-Package Sensors and Smart ICs 250 86 Antennas on Package 251 861 Advantages of Antennas on Package 251 862 State-of-the-Art Antennas on Package 253 87 System-on-Package Topology Decision 254 88 Simulation Challenges of System-on-Package 256 89 Design for Test Challenges of System-on-Package 258 810 Economics of System-on-Package 259 811 State-of-the-Art Millimeter-Wave System-on-Package Examples 260 8111 LTCC Amplitude-Shift-Keying Receiver for 60 GHz Applications 260 8112 LTCC-Based Monolithic SoP for 60 GHz Applications 261 8113 E-Band Antenna-on-Package System in eWLB Technology 262 8114 Four-Chip Package with 64-Antenna Array for W-Band Phased-Array Transceivers on an Organic Substrate 264 8115 160 GHz System-on-Package in EWLB Technology for Short-Range Millimeter-Wave Applications 265 812 Keys to Package Selection and Successful Packaging 267 813 Concluding Remarks 268 References 268 9 Assessment of Completed Work and Future Directions in Millimeter-Wave Research 273 91 Evaluation of Research Questions 273 911 Research Question 1 273 912 Research Question 2 274 913 Research Question 3 274 914 Research Question 4 275 915 Research Question 5 275 92 Remaining Research Gaps and Opportunities for Enhancement 276 93 Future Directions 277