ELECTROLUMINESCENCE
CONTENTS LEDS FOR SOLID-STATE LIGHTING INTRODUCTION EVOLUTION OF LIGHT SOURCES AND LIGHTING SYSTEMS HISTORICAL DEVELOPMENT OF LEDS IMPLEMENTATION OF WHITE LIGHT ILLUMINATION WITH AN LED LEDS FOR GENERAL LIGHTING REFERENCES PACKAGING OF LED CHIPS OVERALL PACKAGING PROCESS AND LED PACKAGE TYPES CHIP MOUNTING AND INTERCONNECTION PHOSPHOR COATING AND DISPENSING PROCESS ENCAPSULATION AND MOLDING PROCESS SECONDARY OPTICS AND LENS DESIGN CHIP SCALE AND WAFER LEVEL PACKAGING OF LEDS CHIP SCALE PACKAGING ENABLING TECHNOLOGIES FOR WAFER LEVEL PACKAGING DESIGNS AND STRUCTURES OF LED WAFER LEVEL PACKAGING PROCESSES OF LED WAFER LEVEL PACKAGING BOARD LEVEL ASSEMBLIES AND LED MODULES BOARD LEVEL ASSEMBLY PROCESSES CHIP-ON-BOARD ASSEMBLIES LED MODULES AND CONSIDERATIONS OPTICAL, ELECTRICAL, AND THERMAL PERFORMANCE EVALUATION OF OPTICAL PERFORMANCE POWER SUPPLY AND EFFICIENCY CONSIDERATION OF LED THERMAL PERFORMANCE RELIABILITY ENGINEERING FOR LED PACKAGING CONCEPT OF RELIABILITY AND TEST METHODS FAILURE ANALYSIS AND LIFE ASSESSMENT DESIGN FOR RELIABILITY EMERGING APPLICATIONS OF LEDS LEDS FOR AUTOMOTIVE LIGHTING MICRO- AND MINI-LED DISPLAY LED FOR VISIBLE LIGHT COMMUNICATION LEDS BEYOND VISIBLE LIGHT APPLICATIONS OF UV-LED APPLICATIONS OF IR-LEDS FUTURE OUTLOOK AND OTHER TECHNOLOGY TRENDS