MICRO-ELECTRO-MECHANICAL SYSTEM DESIGN

By F. NAMIS

CONTENTS CHAPTER INTRODUCTION HISTORICAL PERSPECTIVE THE DEVELOPMENT OF MEMS TECHNOLOGY MEMS: PRESENT AND FUTURE MEMS CHALLENGES THE AIM OF THIS BOOK QUESTIONS REFERENCES CHAPTER FABRICATION PROCESSES MATERIALS INTERATOMIC BONDS MATERIAL STRUCTURE CRYSTAL LATTICES MILLER INDICES CRYSTAL IMPERFECTIONS STARTING MATERIAL — SUBSTRATES SINGLE-CRYSTAL SUBSTRATE CZOCHRALSKI GROWTH PROCESS FLOAT ZONE PROCESS POST-CRYSTAL GROWTH PROCESSING SILICON ON INSULATOR (SOI) SUBSTRATE PHYSICAL VAPOR DEPOSITION (PVD) EVAPORATION SPUTTERING CHEMICAL VAPOR DEPOSITION (CVD) ETCHING PROCESSES WET CHEMICAL ETCHING PLASMA ETCHING ION MILLING PATTERNING LITHOGRAPHY LIFT-OFF PROCESS DAMASCENE PROCESS WAFER BONDING SILICON FUSION BONDING ANODIC BONDING ANNEALING CHEMICAL MECHANICAL POLISHING (CMP) 210 MATERIAL DOPING DIFFUSION IMPLANT 211 SUMMARY MEMS TECHNOLOGIES BULK MICROMACHINING WET ETCHING EXAMPLES OF BULK MICROMACHINING PROCESSES SCREAM PENNSOIL LIGA A LIGA ELECTROMAGNETIC MICRODRIVE SACRI?CIAL SURFACE MICROMACHINING SUMMIT™ INTEGRATION OF ELECTRONICS AND MEMS TECHNOLOGY (IMEMS) TECHNOLOGY CHARACTERIZATION RESIDUAL STRESS YOUNG’S MODULUS MATERIAL STRENGTH ELECTRICAL RESISTANCE MECHANICAL PROPERTY MEASUREMENT FOR PROCESS CONTROL ALTERNATIVE MEMS MATERIALS SILICON CARBIDE SILICON GERMANIUM DIAMOND SU-8 SUMMARY SCALING ISSUES FOR MEMS SCALING OF PHYSICAL SYSTEMS GEOMETRIC SCALING MECHANICAL SYSTEM SCALING THERMAL SYSTEM SCALING FLUIDIC SYSTEM SCALING ELECTRICAL SYSTEM SCALING OPTICAL SYSTEM SCALING CHEMICAL AND BIOLOGICAL SYSTEM CONCENTRATION COMPUTATIONAL ISSUES OF SCALE FABRICATION ISSUES OF SCALE MATERIAL ISSUES NEWLY RELEVANT PHYSICAL PHENOMENA DESIGN REALIZATION TOOLS FOR MEMS LAYOUT SUMMIT TECHNOLOGY LAYOUT ANCHORING LAYERS ROTATIONAL HUBS POLY1 BEAM WITH SUBSTRATE CONNECTION DISCRETE HINGES DESIGN RULES MANUFACTURING ISSUES PATTERNING LIMITS ETCH PATTERN UNIFORMITY REGISTRATION ERRORS ETCH COMPATIBILITY STRINGERS FLOATERS LITHO DEPTH OF FOCUS STICTION (DIMPLES) ETCH RELEASE HOLES IMPROPER ANCHOR (AREA OF ANCHOR) DESIGN RULE CHECKING STANDARD COMPONENTS MEMS VISUALIZATION MEMS ANALYSIS ELECTROMECHANICS STRUCTURAL MECHANICS MATERIAL MODELS THERMAL STRAINS AXIAL ROD TORSION ROD BEAM BENDING FLAT PLATE BENDING COLUMNS STIFFNESS COEF?CIENTS DAMPING OSCILLATORY MECHANICAL SYSTEMS AND DAMPING DAMPING MECHANISMS VISCOUS DAMPING DAMPING MODELS SQUEEZE FILM DAMPING MODEL SLIDE FILM DAMPING MODEL ELECTRICAL SYSTEM DYNAMICS ELECTRIC AND MAGNETIC FIELDS ELECTRICAL CIRCUITS — PASSIVE ELEMENTS CAPACITOR INDUCTOR RESISTOR ENERGY SOURCES CIRCUIT INTERCONNECTION MODELING AND DESIGN DESIGN SYNTHESIS MODELING LAGRANGE’S EQUATIONS LAGRANGE’S EQUATIONS WITH NONPOTENTIAL FORCES LAGRANGE’S EQUATIONS WITH EQUATIONS OF CONSTRAINT USE OF LAGRANGE’S EQUATIONS TO OBTAIN LUMPED PARAMETER GOVERNING EQUATIONS OF SYSTEMS ANALYTICAL MECHANICS METHODS FOR CONTINUOUS SYSTEMS NUMERICAL MODELING DESIGN UNCERTAINTY MEMS SENSORS AND ACTUATORS MEMS ACTUATORS ELECTROSTATIC ACTUATION PARALLEL PLATE CAPACITOR INTERDIGITATED COMB CAPACITOR ELECTROSTATIC ACTUATORS THERMAL ACTUATION LORENTZ FORCE ACTUATION MEMS SENSING CAPACITATIVE SENSING PIEZORESISTIVE SENSING PIEZORESISTIVITY PIEZORESISTANCE IN SINGLE-CRYSTAL SILICON PIEZORESISTIVITY OF POLYCRYSTALLINE AND AMORPHOUS SILICON SIGNAL DETECTION ELECTRON TUNNELING SENSOR NOISE NOISE SOURCES MEMS PHYSICAL SENSORS ACCELEROMETER GYROSCOPE PRESSURE SENSORS CHEMICAL SENSORS TAGUCHI GAS SENSOR COMBUSTIBLE GAS SENSOR PACKAGING PACKAGING PROCESS STEPS POSTFABRICATION PROCESSING RELEASE PROCESS DRYING PROCESS COATING PROCESSES ASSEMBLY ENCAPSULATION PACKAGE SELECTION/DESIGN DIE ATTACH WIRE BOND AND SEALING PACKAGING CASE STUDIES R&D PROTOTYPE PACKAGING DMD PACKAGING ELECTRICAL-FLUIDIC PACKAGING CHAPTER 10 RELIABILITY 101 RELIABILITY THEORY AND TERMINOLOGY 102 ESSENTIAL ASPECTS OF PROBABILITY AND STATISTICS FOR RELIABILITY 103 RELIABILITY MODELS WEIBULL MODEL LOGNORMAL MODEL EXPONENTIAL MODEL 104 MEMS FAILURE MECHANISMS OPERATIONAL FAILURE MECHANISMS WEAR FRACTURE FATIGUE CHARGING CREEP STICTION AND ADHESION DEGRADATION MECHANISMS ENVIRONMENTAL FAILURE MECHANISMS SHOCK AND VIBRATION THERMAL CYCLING HUMIDITY RADIATION ELECTROSTATIC DISCHARGE (ESD) 105 MEASUREMENT TECHNIQUES FOR MEMS OPERATIONAL, RELIABILITY, AND FAILURE ANALYSIS TESTING OPTICAL MICROSCOPY SCANNING ELECTRON MICROSCOPY FOCUSED ION BEAM ATOMIC FORCE MICROSCOPE LIFT-OFF STROBOSCOPY BLUR ENVELOPE VIDEO IMAGING INTERFEROMETRY 10510 LASER DOPPLER VELOCIMETER (LDV) 106 MEMS RELIABILITY AND DESIGN 107 MEMS RELIABILITY CASE STUDIES DMD RELIABILITY SANDIA MICROENGINE 108 SUMMARY