ASM HANDBOOK: MATERIALS SELECTION AND DESIGN

By H. HATAS

CONTENTS CHAPTER 1: RECENT ADVANCES IN THIN-FILM DEPOSITION MOLECULAR-BEAM DEPOSITION OF HIGH-K GATE DIELECTRICS FOR ADVANCED CMOS LEPECVD — A PRODUCTION TECHNIQUE FOR SIGE MOSFETS AND MODFETS THIN-FILM ENGINEERING BY ATOMIC-LAYER DEPOSITION FOR ULTRA-SCALED AND NOVEL DEVICES ATOMIC-LAYER DEPOSITED BARRIER AND SEED LAYERS FOR INTERCONNECTS COPPER CVD FOR CONFORMAL ULTRATHIN-FILM DEPOSITION PUSHING PVD TO THE LIMITS — RECENT ADVANCES SURFACE ENGINEERING USING SELF-ASSEMBLED MONOLAYERS: MODULE SUBSTRATES FOR ATOMIC-LAYER DEPOSITION SELECTIVE AIRGAPS: TOWARDS A SCALABLE LOW-K SOLUTION SILICIDES — RECENT ADVANCES AND PROSPECTS TEM CHARACTERIZATION OF STRAINED SILICON CHAPTER 2: MATERIAL ASPECTS OF NON-VOLATILE MEMORIES AN INTRODUCTION TO NONVOLATILE MEMORY TECHNOLOGY FLOATING-DOT MEMORY TRANSISTORS ON SOI SUBSTRATES ION-BEAM SYNTHESIS OF NANOCRYSTALS FOR MULTIDOT MEMORY STRUCTURES SCALING OF FERROELECTRIC-BASED MEMORY CONCEPTS DEVICE CONCEPTS WITH MAGNETIC TUNNEL JUNCTIONS PHASE-CHANGE MEMORIES AMORPHOUS-TO-FCC TRANSITION IN GESBTE ALLOYS ORGANIC NONVOLATILE MEMORIES CHAPTER 3: MATERIALS FOR INTERCONNECTS INTERCONNECT TECHNOLOGY — TODAY, RECENT ADVANCES AND A LOOK INTO THE FUTURE DIELECTRIC AND SCALING EFFECTS ON ELECTROMIGRATION FOR CU INTERCONNECTS TEXTURE AND STRESS STUDY OF SUB-MICRON COPPER INTER- CONNECT LINES USING X-RAY MICRO DIFFRACTION STRESS MODELING FOR COPPER INTERCONNECT STRUCTURES CONDUCTIVITY ENHANCEMENT IN METALLIZATION STRUCTURES OF REGULAR GRAINS ADVANCED BARRIERS FOR COPPER INTERCONNECTS SYNTHESIS AND CHARACTERIZATION OF COMPOUNDS OBTAINED BY CROSSLINKING OF POLYMETHYL- HYDROSILOXANE BY AROMATIC RINGS REVEALING THE POROUS STRUCTURE OF LOW-K MATERIALS THROUGH SOLVENT DIFFUSION CARBON NANOTUBE VIA TECHNOLOGIES FOR FUTURE LSI INTECONNECTS NICKEL NANOWIRES OBTAINED BY TEMPLATE SYNTHESIS CHAPTER 4: MATERIALS FOR ASSEMBLY/PACKAGING THE IMPORTANCE OF POLYMERS IN WAFER-LEVEL PACKAGING ELECTRICALLY CONDUCTIVE ADHESIVES AS SOLDER ALTERNATIVE: A FEASIBLE CHALLENGE THE ROLE OF AU/SN SOLDER IN PACKAGING PACKAGING MATERIALS: ORGANIC–INORGANIC HYBRIDS FOR MILLIMETRE-WAVE OPTOELECTRONIC WAFER-LEVEL THREE-DIMENSIONAL HYPER-INTEGRATION TECHNOLOGY USING DIELECTRIC ADHESIVE WAFER BONDING CHAPTER 5: ADVANCED MATERIALS CHARACTERIZATION CHALLENGES TO ADVANCED MATERIALS CHARACTERIZATION FOR ULSI APPLICATIONS ADVANCED MATERIAL CHARACTERIZATION BY TOFSIMS IN MICROELECTRONICS ELECTRONIC PROPERTIES OF THE INTERFACE FORMED BY PR2O3 GROWTH ON SI(001), SI(111) AND SIC(0001) SURFACES MATERIALS CHARACTERIZATION BY ELLIPSOMETRY THERMAL DESORPTION SPECTROMETRY AS A METHOD OF ANALYSIS FOR ADVANCED INTERCONNECT MATERIALS ELECTRON BACKSCATTER DIFFRACTION: APPLICATION TO CU INTERCONNECTS IN TOP-VIEW AND CROSS SECTION X-RAY REFLECTIVITY CHARACTERISATION OF THIN-FILM AND MULTILAYER STRUCTURES