THE ELECTRONIC PACKAGING HANDBOOK
CONTENTS FUNDAMENTALS OF THE DESIGN PROCESS SURFACE MOUNT TECHNOLOGY DIRECT CHIP ATTACH CIRCUIT BOARDS EMC AND PRINTED CIRCUIT BOARD DESIGN HYBRID ASSEMBLIES INTERCONNECTS DESIGN FOR TEST 10 ADHESIVE AND ITS APPLICATION 11 THERMAL MANAGEMENT 12 TESTING 13 INSPECTION 14 PACKAGE/ENCLOSURE 15 ELECTRONICS PACKAGE RELIABILITY AND FAILURE ANALYSIS: A MICROMECHANICS-BASED APPROACH 16 PRODUCT SAFETY AND THIRD-PARTY CERTI?CATION INTRODUCTION CONCURRENT ENGINEERING (CE) IS A PRESENT-DAY METHOD USED TO SHORTEN THE TIME TO MARKET FOR NEW OR IMPROVED PRODUCTS LET IT BE ASSUMED THAT A PRODUCT WILL, UPON REACHING THE MARKETPLACE, BE COMPETITIVE IN NEARLY EVERY RESPECT, SUCH AS QUALITY AND COST, FOR EXAMPLE BUT THE MARKETPLACE HAS SHOWN THAT PRODUCTS, EVEN THOUGH COMPETITIVE, MUST NOT BE LATE TO MARKET, BECAUSE MARKET SHARE, AND THEREFORE *ADAPTED FROM WHITAKER, J , THE ELECTRONICS ENGINEERING HANDBOOK, CHAPTER 146, “CONCURRENT ENGINEERING,” BY FRANCIS LONG, CRC/IEEE PRESS, 1997